Capabilities
| Kara Capabilities | |||
| Item | Technical Specification | ||
| Number of layers | 1-32 | ||
| Laminate | XPC - FR1 - FR2 - CEM1 - CEM3 - FR4 | ||
| Maximum Board Size | 400*600mm | ||
| Board Thickness | 0.2 - 3.2 mm | ||
| Minimum line track | 0.1 mm | ||
| Minimum Line gap | 0.1 mm | ||
| Solder Mask Type | White ,black ,green ,red | ||
|
Surface Treatment |
Flash Gold | 1-3 µ | |
| Sn/Pb HASL | 100-1100µ | ||
| Leadfree HASL | 100-1100µ | ||
| Liquid Flux | 5-15µ | ||
| Imerssion Sn | 20-30µ | ||
| Outline | V-cut , Punch ,CNC | ||
| NPTH Hole Size | 0.3 mm - 6.3 mm | ||
| PTH Hole Size | 0.3 mm - 6.3 mm | ||
| Electrical Test | Yes | ||